Discussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)
نویسندگان
چکیده
منابع مشابه
Bertók T., Sediva A., Katrlik J., Gemeiner P., Mikula M., Nosko M., Tkáč J.; Talanta 108 (2013), pp. 11-18
a Department of Glycobiotechnology, Institute of Chemistry, Slovak Academy of Sciences, Dúbravská cesta 9, 845 38, Bratislava, Slovak Republic; b Department of Graphic Arts Technology and Applied Photochemistry, Faculty of Chemical and Food Technology, Slovak University of Technology, Radlinského 9, 812 37, Bratislava, Slovak Republic Institute of Materials and Machine Mechanics, Slovak Academy...
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The Technical Brief by Roache [1] presents ten items of discussion of our factor of safety (FS) method for solution verification [2]. Our responses are listed below item-by-item using the same numbering as Roache. The nomenclature mostly follows our own and not Roache’s such as pRE for the order of accuracy calculated using the Richardson Extrapolation as opposed to the observed order of conver...
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ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 2011
ISSN: 1043-7398,1528-9044
DOI: 10.1115/1.4000901